ค่าพารามิเตอร์ที่เหมาะสมของกระบวนการเชื่อมแผ่นฟิล์มนำไฟฟ้าแอนนิโซโทปิก

Abstract

The objective of this independent study was conducted to find out parameters optimization of anisotropic conductive film bonding process of MB-300 bonding machine. In keyboard process found peel strength testing of new anisotropic conductive film had been out of specification (Spec > 2 N-cm) which it cannot connect between top and bottom of keyboard product. And also resistant of keyboard circuit increased that had been out of specification (Spec < 260 Ohm) because if surface of anisotropic conductive film and circuit of keyboard a few contact which resistant was increased. The defect was 7,500 piece per year or 10.3% of defect or cost 0.45 million baht per year that root cause come from parameters setting in bonding process. The study revealed there were three factors affecting of anisotropic conductive film bonding process 1) Pressure of bonding 2)Temperature of bonding 3)Time of bonding The researcher applied the design of experiment called full factorial 23 additional 4 point. Then considering equation of curvature have or not? If have, continue to central composite design. It was concluded that the pressure of bonding was 3.3 Mpa, temperature of bonding was 170 degree Celsius and time of bonding was 17 second. After implementing the parameters in actual process for 3 days. Peel strength test result was 2.2 N-cm and resistant of keyboard circuit test was 249.8 Ohm which both result can passed quality specification of customer.