การปรับปรุงกระบวนการเทคโนโลยีการยึดบนผิวงานโดยใช้เทคนิคการผลิตแบบลีน

Abstract

This research introduces the improvement of the surface mount technology process using lean manufacturing technique to improve and reduce takt time in the process. Therefore, in process of surface mount technology cannot produce products that meet customer demand. Currently, this process cannot produce sufficient products to meet customer demand 1,100 pieces per day in 10 sub processes, material prepare process, FPC stick on carrier process, lot number printing process, solder screen printing process, screen printing inspection process, chip mounting process, reflow soldering process, remove FPC from carrier process, appearance check process and packing process. In order to improve processes, standard time of each process was determined and were created analysis improvement by value stream mapping. Lean thinking were used for improvements to analyze root cause and solve problems, including changing floor plant layout to reduce lead time and non-value-added activities. For the evaluation of the result, compare takt time and activities before-after improvement and compare reduce rate after improve. The implementation of improvements focuses on reducing bottleneck takt time in each process. At material prepare process improve by changing the baking tray size for more quantity input. Besides, FPC stick on carrier process change jig from resin carrier to magnet carrier effect to remove FPC from carrier process can cancel method attached tape and remove tape in the process. At Chip mounting process rearrange electronic part for mounting machine easily pick up part. And creating jig at appearance check process reduce time for operator checking after improvement, the result of this study can achieve the goal. Productivity improve from 1,037 pieces per day to 1,352 pieces per day can achieve demand of customer. Cycle time reduce from 83.63 sec per piece to 67.89 sec per piece reduce rate 18.82%.