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DC Field | Value | Language |
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dc.contributor.author | D. Pejchang | en_US |
dc.contributor.author | M. Medhisuwakul | en_US |
dc.contributor.author | S. Sansongsiri | en_US |
dc.date.accessioned | 2018-09-04T06:06:03Z | - |
dc.date.available | 2018-09-04T06:06:03Z | - |
dc.date.issued | 2012-01-01 | en_US |
dc.identifier.issn | 16627482 | en_US |
dc.identifier.issn | 16609336 | en_US |
dc.identifier.other | 2-s2.0-81255144912 | en_US |
dc.identifier.other | 10.4028/www.scientific.net/AMM.110-116.478 | en_US |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=81255144912&origin=inward | en_US |
dc.identifier.uri | http://cmuir.cmu.ac.th/jspui/handle/6653943832/51676 | - |
dc.description.abstract | This research is aimed to synthesize titanium nitride (TiN) thin films on stainless steel 304 using metal vacuum arc surface coating technique. A titanium rod is used as cathode. Plasma is generated by applying the arc pulse voltage of 450 V between the electrodes in N2 atmosphere. The pressure of N2 is varied from 10-5 to 10-3 torr when compare with uncoated-stainless steel 304. The bias voltage for substrate is-1 kV. Then the properties of the films are investigated. Firstly, microstructures of TiN thin films are indentified by X-ray diffraction method (XRD) and the crosssection scanning electron microscopy (SEM) is used to measure the thickness. Secondly, the corrosion resistance is examined by electrochemical test in 1 M H2SO4 solution at 25°C. The electrical resistivity is analyzed by interfacial contact resistance measurements. © (2012) Trans Tech Publications, Switzerland. | en_US |
dc.subject | Engineering | en_US |
dc.title | Effects of N2 pressure on properties of titanium nitride films by filter cathodic vacuum arc for bipolar plates in PEM fuel cells | en_US |
dc.type | Book Series | en_US |
article.title.sourcetitle | Applied Mechanics and Materials | en_US |
article.volume | 110-116 | en_US |
article.stream.affiliations | Chiang Mai University | en_US |
article.stream.affiliations | Commission on Higher Education | en_US |
Appears in Collections: | CMUL: Journal Articles |
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