Please use this identifier to cite or link to this item: http://cmuir.cmu.ac.th/jspui/handle/6653943832/51541
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dc.contributor.authorWimalin S. Laosiritawornen_US
dc.contributor.authorPakorn Aoonchanen_US
dc.date.accessioned2018-09-04T06:03:56Z-
dc.date.available2018-09-04T06:03:56Z-
dc.date.issued2012-01-01en_US
dc.identifier.issn20780958en_US
dc.identifier.other2-s2.0-84906555892en_US
dc.identifier.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84906555892&origin=inwarden_US
dc.identifier.urihttp://cmuir.cmu.ac.th/jspui/handle/6653943832/51541-
dc.description.abstract© 2012 Newswood Limited. All rights reserved. This paper investigated the application of design of experiment technique to optimized multi-panel lamination process in the flexible printed circuit production. Three significant factors affecting lamination process, which are, prebake time, lamination pressure and type of film, were identified with cause and effect matrix and failure mode and effect analysis. Full factorial design experiments were conducted. The results suggested that all factors, their two and three way interactions are significant. Optimal setting was identified with response optimizer. The optimum process setting was at 20 minute prebake time, 370 Klb. Lamination pressure and Sekisui film type. This new setting has resulted in defect reduction from 4.82% to 0.55%.en_US
dc.subjectComputer Scienceen_US
dc.titleMulti-panel lamination process optimization with design of experimenten_US
dc.typeConference Proceedingen_US
article.title.sourcetitleLecture Notes in Engineering and Computer Scienceen_US
article.volume2en_US
article.stream.affiliationsChiang Mai Universityen_US
Appears in Collections:CMUL: Journal Articles

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