Please use this identifier to cite or link to this item: http://cmuir.cmu.ac.th/jspui/handle/6653943832/76187
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dc.contributor.authorJantrawan Pumchusaken_US
dc.contributor.authorNonthawat Thajinaen_US
dc.contributor.authorWatcharakorn Keawsujaien_US
dc.contributor.authorPattarakamon Chaiwanen_US
dc.date.accessioned2022-10-16T07:06:21Z-
dc.date.available2022-10-16T07:06:21Z-
dc.date.issued2021-03-01en_US
dc.identifier.issn20734360en_US
dc.identifier.other2-s2.0-85102288567en_US
dc.identifier.other10.3390/polym13050754en_US
dc.identifier.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85102288567&origin=inwarden_US
dc.identifier.urihttp://cmuir.cmu.ac.th/jspui/handle/6653943832/76187-
dc.description.abstractThis work aims to explore the effect of organo-modified montmorillonite nanoclay (O-MMT) on the mechanical, thermo-mechanical, and thermal properties of carbon fiber-reinforced phenolic composites (CFRP). CFRP at variable O-MMT contents (from 0 to 2.5 wt%) were prepared. The addition of 1.5 wt% O-MMT was found to give the heat resistant polymer composite optimum properties. Compared to the CFRP, the CFRP with 1.5 wt% O-MMT provided a higher tensile strength of 64 MPa (+20%), higher impact strength of 49 kJ/m2 (+51%), but a little lower bending strength of 162 MPa (−1%). The composite showed a 64% higher storage modulus at 30◦C of 6.4 GPa. It also could reserve its high modulus up to 145◦C. Moreover, it had a higher heat deflection temperature of 152◦C (+1%) and a higher thermal degradation temperature of 630◦C. This composite could maintain its mechanical properties at high temperature and was a good candidate for heat resistant material.en_US
dc.subjectChemistryen_US
dc.subjectMaterials Scienceen_US
dc.titleEffect of organo-modified montmorillonite nanoclay on mechanical, thermo-mechanical, and thermal properties of carbon fiber-reinforced phenolic compositesen_US
dc.typeJournalen_US
article.title.sourcetitlePolymersen_US
article.volume13en_US
article.stream.affiliationsChiang Mai Universityen_US
Appears in Collections:CMUL: Journal Articles

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