Design and Manufacturing of Angular DC Magnetron Co-Sputtering System to Provide Multilayer Films

Abstract

The research aims to design and produced a new vacuum chamber set of the angular multi-target magnetron sputtering system was supplied by three patterns of the process gas emissions in one system. One pattern supplies the gas directly in front of the target surface, while another pattern supplies the gas beside the chamber, and another pattern supplies the gas to the bottom of the lid. The vacuum chamber set was designed as a top-down sputtering process which has six major components is new designed and produced, consists of the base, the chamber with a window, the feedthrough for the anode pole, the lid, the magnetron target-holder gun, and the rotate substrate-holder set. When the system is completely assembled, then try to test the leakage and plasma ignition until both passes tested, and then a preliminary test of the sputtering process to provide a thin film with sputtered one copper target which was mounted on one gun onto glass slide substrates for the gas emissions of three patterns. After that run sputtering process to provide the multilayers films with three target materials include copper, aluminum, and brass, which was mounted on three guns onto the rotate glass slide substrates. The results of the thin film thickness from the sputtering process was found this system can be used to build a thin film for changing various sputtering voltages, including the system can be successfully used to provide multilayers film and generate argon plasma which was supplied three patterns of the process gas emissions in one system.