Please use this identifier to cite or link to this item: http://cmuir.cmu.ac.th/jspui/handle/6653943832/71850
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dc.contributor.authorS. Sarapiromen_US
dc.contributor.authorL. D. Yuen_US
dc.date.accessioned2021-01-27T04:16:44Z-
dc.date.available2021-01-27T04:16:44Z-
dc.date.issued2021-01-25en_US
dc.identifier.issn02578972en_US
dc.identifier.other2-s2.0-85096606106en_US
dc.identifier.other10.1016/j.surfcoat.2020.126638en_US
dc.identifier.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85096606106&origin=inwarden_US
dc.identifier.urihttp://cmuir.cmu.ac.th/jspui/handle/6653943832/71850-
dc.description.abstract© 2020 Elsevier B.V. In development of plasma biotechnology for applications in agriculture and medicine, we investigated plasma treatment effects on crop seeds. Sunflower seeds were treated with three different types of plasma, i.e. low-pressure plasma, dielectric barriers discharge plasma and jet plasma. The plasma was characterized using optical emission spectroscopy for understanding of physical and chemical species in the plasma. Plasma-treated seeds were studied for the plasma effects on both physical and biological properties, including the surface morphology and roughness, contact angle, water absorption rate, germination rate, survival rate and growth rate, etc. In general, with increasing of the plasma power, the seed surface roughness increased, the contact angle decreased and thus the wettability increased, the water absorption depended on the power, and the germination and growth rates increased to maximum under certain plasma parameters. The plasma bioeffects are discussed in association with the physical effects.en_US
dc.subjectChemistryen_US
dc.subjectMaterials Scienceen_US
dc.subjectPhysics and Astronomyen_US
dc.titleLow-pressure and atmospheric plasma treatments of sunflower seedsen_US
dc.typeJournalen_US
article.title.sourcetitleSurface and Coatings Technologyen_US
article.volume406en_US
article.stream.affiliationsMaejo Universityen_US
article.stream.affiliationsChiang Mai Universityen_US
Appears in Collections:CMUL: Journal Articles

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