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dc.contributor.authorK. Jongchansittoen_US
dc.contributor.authorP. Jongchansittoen_US
dc.contributor.authorI. Preechawuttipongen_US
dc.date.accessioned2020-10-14T08:33:39Z-
dc.date.available2020-10-14T08:33:39Z-
dc.date.issued2020-07-27en_US
dc.identifier.issn1757899Xen_US
dc.identifier.issn17578981en_US
dc.identifier.other2-s2.0-85090289027en_US
dc.identifier.other10.1088/1757-899X/886/1/012050en_US
dc.identifier.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=85090289027&origin=inwarden_US
dc.identifier.urihttp://cmuir.cmu.ac.th/jspui/handle/6653943832/70560-
dc.description.abstract© Published under licence by IOP Publishing Ltd. This study set out to investigate numerical simulations of heat conduction to validate existing experimental results of two-dimensional binary granular mixtures subjected to mechanical loading. Data for this study were collected using molecular dynamics (henceforth MD) method. Three different configurations of the granular composite samples were systematically prepared under similar experimental conditions. A confined mechanical loading was applied to the granular samples. The fields of normalized temperature change of each particle were plotted for an individual sample. The results were statistically analyzed under a static equilibrium condition. The results indicate that simulation is in good correlation with the experiments in terms of statistical analysis via the probability of the distributions of the normalized temperature change. It also revealed that the normalized temperature changes which are greater than the average temperature distributes as an exponential decreasing for all tested samples. This study is in line with other studies that are related to force distribution of law. Less than 50% of particle numbers that have the normalized temperature changes, which are greater than the average value, is also explored. Besides, localizations of the temperature were found in the individual sample.en_US
dc.subjectEngineeringen_US
dc.subjectMaterials Scienceen_US
dc.titleNumerical Validation of Heat Conduction in 2D Binary Granular Mixtures under Mechanical Loadingen_US
dc.typeConference Proceedingen_US
article.title.sourcetitleIOP Conference Series: Materials Science and Engineeringen_US
article.volume886en_US
article.stream.affiliationsChiang Mai Universityen_US
Appears in Collections:CMUL: Journal Articles

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