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DC Field | Value | Language |
---|---|---|
dc.contributor.author | T. Bannuru | en_US |
dc.contributor.author | S. Narksitipan | en_US |
dc.contributor.author | W. L. Brown | en_US |
dc.contributor.author | R. P. Vinci | en_US |
dc.date.accessioned | 2018-09-10T04:04:02Z | - |
dc.date.available | 2018-09-10T04:04:02Z | - |
dc.date.issued | 2007-04-30 | en_US |
dc.identifier.issn | 0277786X | en_US |
dc.identifier.other | 2-s2.0-34247356929 | en_US |
dc.identifier.other | 10.1117/12.700834 | en_US |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=34247356929&origin=inward | en_US |
dc.identifier.uri | http://cmuir.cmu.ac.th/jspui/handle/6653943832/61087 | - |
dc.description.abstract | Au, Au-V solid solution, and Au-V2O5dispersion films were fabricated for comparison of electrical and mechanical characteristics. Resistivity and nanoindentation hardness increased with increasing V content in all films, but the ratio of resistivity increase to hardness increase was much lower for the Au-V2O5films. Measurements of contact force and electrical contact resistance between pairs of Au or Au-V films show that increased hardness and resistivity in the alloy films results in higher contact resistance and less adhesion than in pure Au. These results imply that the Au-V2O5films may exhibit attractive behavior when used in a contact configuration, but this has not yet been tested. | en_US |
dc.subject | Engineering | en_US |
dc.subject | Physics and Astronomy | en_US |
dc.title | Effects of V additions on the mechanical behavior of Au thin films for MEMS contact switches | en_US |
dc.type | Conference Proceeding | en_US |
article.title.sourcetitle | Proceedings of SPIE - The International Society for Optical Engineering | en_US |
article.volume | 6463 | en_US |
article.stream.affiliations | Lehigh University | en_US |
article.stream.affiliations | Chiang Mai University | en_US |
Appears in Collections: | CMUL: Journal Articles |
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