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dc.contributor.authorPaowphattra Kamphikulen_US
dc.contributor.authorRangsan Wongsanen_US
dc.date.accessioned2018-09-05T02:57:23Z-
dc.date.available2018-09-05T02:57:23Z-
dc.date.issued2016-09-06en_US
dc.identifier.other2-s2.0-84988805171en_US
dc.identifier.other10.1109/ECTICon.2016.7561349en_US
dc.identifier.urihttps://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84988805171&origin=inwarden_US
dc.identifier.urihttp://cmuir.cmu.ac.th/jspui/handle/6653943832/55512-
dc.description.abstract© 2016 IEEE. This paper proposes the new technique of the metamaterial on the structure of the curved-woodpile Electromagnetic Band Gap (EBG) for gain improvement of a conventional rectangular horn antenna without its construction enlargement. The curved-woodpile EBG, which is the 3D volumetric structure, has been utilized to enhance the gain instead by transferring the electromagnetic fields from aperture of a horn through this EBG. This paper also presents the design procedures of a dielectric which is inserted in layers of the curved-woodpile EBG for reducing the distance between a horn and EBG. The proposed technique has the advantages of low profile, low cost for fabrication and light weight. From the results by using the simulation software, the gain at the operating frequency of 10 GHz is 24.17 dB, suitable for application for X-band radar and I-band beyond following the IEEE and the ITU, respectively, that higher than the gain of the basic rectangular horn antenna around 7 dB with adding only one appropriated metamaterial structure.en_US
dc.subjectComputer Scienceen_US
dc.subjectEngineeringen_US
dc.titleGain improvement for rectangular horn antenna by using curved-woodpile metamaterialen_US
dc.typeConference Proceedingen_US
article.title.sourcetitle2016 13th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology, ECTI-CON 2016en_US
article.stream.affiliationsChiang Mai Universityen_US
article.stream.affiliationsSuranaree University of Technologyen_US
Appears in Collections:CMUL: Journal Articles

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