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DC Field | Value | Language |
---|---|---|
dc.contributor.author | Paiboon Limpitipanich | en_US |
dc.contributor.author | Anucha Promwungkwa | en_US |
dc.date.accessioned | 2018-09-04T09:50:43Z | - |
dc.date.available | 2018-09-04T09:50:43Z | - |
dc.date.issued | 2014-01-01 | en_US |
dc.identifier.issn | 10226680 | en_US |
dc.identifier.other | 2-s2.0-84901486258 | en_US |
dc.identifier.other | 10.4028/www.scientific.net/AMR.931-932.1308 | en_US |
dc.identifier.uri | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84901486258&origin=inward | en_US |
dc.identifier.uri | http://cmuir.cmu.ac.th/jspui/handle/6653943832/53518 | - |
dc.description.abstract | Tensile strength of some natural fibers such as hemp is higher than that of steel. To determine tensile properties of hemp fiber, a fiber or bundle is tensile tested with universal testing machine that is controlled by personal computer. This paper presents a small tensile testing equipment that is controlled by Raspberry Pi (RPi), a credit-card-sized single-board computer. General Purpose Input Output (GPIO) pins on RPi were used for controlling the machine crosshead and receiving the tensile load that apply to a hemp bundle. A stepper motor was used to drive the crosshead. Tensile load was measured by using a load measurement system included load-cell, instrument amplifier, and analog-to-digital converter. The applied load and extension were real-time displayed and continuously recorded throughout the test. Testing hemp-fiber bundles with the proposed equipment found that their tensile strength and Young's modulus were 446.75±184.36 MPa and 18.23±8.26 GPa, respectively. These results were in good agreement with the properties founded in other publications. Test results also found that hemp-fiber bundle with smaller diameter showed higher tensile strength than that of larger one. © (2014) Trans Tech Publications, Switzerland. | en_US |
dc.subject | Engineering | en_US |
dc.title | Determination of tensile properties of hemp-fiber bundle by using tensile testing equipment with raspberry Pi | en_US |
dc.type | Book Series | en_US |
article.title.sourcetitle | Advanced Materials Research | en_US |
article.volume | 931-932 | en_US |
article.stream.affiliations | Chiang Mai University | en_US |
Appears in Collections: | CMUL: Journal Articles |
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